Molecular formula: BN
Molecular weight: 24.82
CAS No.10042-11-5
Hexagonal boron nitride is an advanced ceramic material that exhibits a sheet-like microstructure and a hexagonal crystal molecular structure. Hexagonal boron nitride has very special and excellent physical and chemical properties, as well as excellent thermal conductivity and electrical insulation. Resistant to chemical corrosion and oxidation, with a temperature resistance of up to 1000 ℃ in air, and up to 2000 ℃ in inert gas and vacuum conditions. Boron nitride undergoes high-temperature reaction sintering at 1950 ℃, with stable chemical and physical properties and excellent thermal conductivity (single crystal thermal conductivity of about 250-300W/mk). Currently, the company produces flake shaped crystalline powders with a single crystal size of 500 nanometers to 20 microns, and can also produce nanoscale spherical boron nitride.
Hexagonal boron nitride is highly favored by the electronic industry due to its rare conditions of high thermal conductivity and electrical insulation performance. Domestic and foreign electronic manufacturers have conducted large-scale applications in thermal conductive plastics, semiconductor packaging filling, LED heat dissipation packaging, and other fields. In some traditional metal smelting, casting, special lubricants, glass industries, etc., boron nitride has excellent performance.